Semtech said it has commenced production of integrated silicon subsystems intended for 50G optical transceivers in fronthaul cellular radios. A solution pairing Semtech's GN225 Clock and Data Recovery chip with the GN1700TI TIA caters to 10 km duplex radio links, while 15 km bi-directional links are served by the GN2255S CDR and GN1700TI TIA. Semtech will also market a solution pairing the GN1700TI TIA with its GN2256 CDR model, targeting WDM links and extended-reach architectures. Read more
Semtech joins the XPO MSA with a portfolio of 200G/lane TIAs and Mach-Zehnder modulator drivers targeting 12.8 Tbps liquid-cooled pluggable optical modules for next-generation AI networks. Read more
Semtech Corporation has announced its membership in the eXtra-dense Pluggable Optics Multi-Source Agreement (XPO MSA). This industry initiative aims to enable high-bandwidth AI optical interconnects for AI network infrastructure. Read more
Semtech said LoRa wireless technology is increasingly being used to monitor solar farm equipment beyond panels, particularly trackers, inverters and cleaning robots at utility-scale sites. Read more
Semtech’s LR2022 and LR2012 LoRa Plus transceivers target a range of IoT deployments, from sub-GHz sensors to global multiband non-terrestrial networks (NTNs). The devices are subsets of the previously announced LR2021 and share its fourth-generation LoRa Plus IP core. Read more
Semtech will host the LoRa® Global Ecosystem Forum at the 2026 International Internet of Things Exhibition (IOTE), taking place at the Shenzhen World Exhibition & Convention Center (Bao'an District) from Aug. 26-28. Read more
Semtech has outlined power, reach and loss targets for 200G linear pluggable optics, setting out its current assumptions for data centre links. Read more
Can copper continue to scale for next-generation AI data center interconnects? Developed by TE Connectivity in collaboration with Semtech, this DesignCon 2026 Best Paper Award-winning technical paper explores passive and active copper architectures—including DAC, ACC, and Co-Packaged Copper (CPC)—and how they can help enable the transition to the 448G era. Read more